Structure of conventional package 传统封装结构

Wafer IC failure mode

Failure Classification

Physical Failure (Structure)

- Popcorn

- Delamination

- Crack (Package/Die)

Electrical Failure (Connection)

- Open

- Short

- Leakage

- Function

In-Process Failure (Production)

- Front-end (before molding)

- Back-end (After molding)

- Testing (FT/Burn-in)

Reliability Failure (Qualification)

- Temperature

- Humidity

- Pressure

- Voltage

Popcorn (爆裂)

TQFP package (bottom popcorn)

FBGA package (top popcorn)

Delamination (离裂)

Crack (破裂)

Assembly Flow 装配流程

Wiring Bondability (TSOP/BGA)

Inner Lead Bondability (TCP/COF) 内部引线可焊性（TCP/COF）

Bondability (Bonding Force) 可结合性，可焊性（结合力）

X-RAY Inspection (NDT)

2nd BondingBroken

Open Failure

Short Failure

Short Failure (Tin Whisker)

Short Failure

Leakage Failure

Function Failure

Assembled Related – Machine/Man Damaged

Assembled Related – Environment (Particle Damaged)

ESD Cases of Driver ICs

Difference between ESD and EOS

Major Mode of Damages by ESD

来源：材料与可靠性-嘉峪检测网